CPU用ダイ接続/放熱材料
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| Model | Electrical Resistivity [ohm-cm] | Dielectric Strength [Volts/mil] | Glass Transition Temp.[℃] | Current Carrying Capabilities [Amp/mm²] | Feature |
|---|---|---|---|---|---|
| PRIMA-BOND ME8512 | <4x10-4 (150℃/60min) | N/A | 52 | 50 | Epoxy paste adhesive |
| ME8456-DA | <4x10-4 (150℃/60min) | N/A | -20 | 35 | Flexible die-attach |
| MC8880 | <5x10-2 (200℃/1) | N/A | 240 | - | Die-attach |
| ME7519-LB | >1014 | - | 52 | - | Die-attach adhesive |