マイクロチップ( Micro Chip)接続接着剤 ペースト

取扱いメーカー
すぐお見積りいたします
Model | Electrical Resistivity [ohm-cm] | Dielectric Strength [Volts/mil] | Glass Transition Temp.[℃] | Current Carrying Capabilities [Amp/mm²] | Feature |
---|---|---|---|---|---|
ME8418-SC | <4x10-4 (100℃/60min) | N/A | 90 | >50 | Die attach |
ME8650-RC | <5x10-4 (150℃/60min) | N/A | 0.4 | 50 | Inline die attach |
ME8630-SSC | <5x10-4 (150℃/5min) | N/A | 80 | >20 | Snap Curing die-attach |
PRIMA-BOND EG8020 | <4x10-4 (150℃/60min) | N/A | 50 | >40 | Epoxy paste adhesive |
PRIMA-SOLDER EG8050 | <4x10-4 (150℃/60min) | N/A | -20 | 35 | Epoxy paste adhesive |