マイクロチップ( Micro Chip)接続接着剤 フィルム
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仕様
| Model | Electrical Resistivity [ohm-cm] | Dielectric Strength [Volts/mil] | Glass Transition Temp.[℃] | Current Carrying Capabilities [Amp/mm²] | Feature |
|---|---|---|---|---|---|
| ESP8450-HF | <3x10-4 (150℃/60min) | N/A | -60/50 | N/A | Epoxy film |
| ESP8660-HK | <4x10-4 (150℃/60min) | N/A | 175±10% | N/A | Die attach Film |
| ESP8680-SC | <5x10-4 (150℃/60min) | N/A | 130 | N/A | Epoxy film adhesive |
| ESP7660-HK | >1x1014 (150℃/60min | >750 | 175 | N/A | Die attach film |
| ESP7450-RC | >1x1014 (25℃/As is) | 750 | -60 | N/A | Tack-free epoxy film |
| ESP8450 | <5x10-4 (150℃/1hour) | N/A | -60 | N/A | Epoxy film |
| RTC8660-HK | >5x10-4 (150℃/10min) | N/A | 90/175 | - | Die-attach film adhesive |