電子部品(マイクロ波&ミリ波)の総合商社:株式会社AMT

AI Technology

エー・アイ・テクノロジー社

AI Technology(エー・アイ・テクノロジー )社は、米国ニュージャージー州で電子部品向けの導電性接着剤/フィルムや熱対策の材料を開発・製造しています。

主な取扱製品

 

 

製品の型番をクリックすると、メーカーのデータシートが開きます。

 

ダイ接着剤 Die Attach Adhesives

 

Die Attach Film
Model Electrical
Resistivity
[ohm-cm]
Dielectric
Strength
[Volts/mil]
Glass
Transition
Temp.[℃]
Current
Carrying
Capabilities
[Amp/mm²]
Feature
ESP8450-HF <3x10-4
(150℃/60min)
N/A -60/50 N/A Epoxy film
ESP8660-HK <4x10-4
(150℃/60min)
N/A 175±10% N/A Die attach
Film
ESP8680-SC <5x10-4
(150℃/60min)
N/A 130 N/A Epoxy film
adhesive
ESP7660-HK >1x1014
(150℃/60min)
>750 175 N/A Die attach film
ESP7450-RC >1x1014
(25℃/As is)
750 -60 N/A Tack-free
epoxy film
ESP8450 <5x10-4
(150℃/1hour)
N/A -60 N/A Epoxy film
RTC8660-HK >5x10-4
(150℃/10min)
N/A 90/175 - Die-attach
film adhesive
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Die Attach Paste

EG8050

Model Electrical
Resistivity
[ohm-cm]
Dielectric
Strength
[Volts/mil]
Glass
Transition
Temp.[℃]
Current
Carrying
Capabilities
[Amp/mm²]
Feature
ME8418-SC <4x10-4
(100℃/60min)
N/A 90 >50 Die attach
ME8650-RC <5x10-4
(150℃/60min)
N/A -20/-50
Minor
50 Inline
die attach
ME8630-SSC <5x10-4
(150℃/5min)
N/A 80 >20 Snap Curing
die-attach
PRIMA-BOND
EG8020
<4x10-4
(150℃/60min)
N/A 50 >40 Epoxy paste
adhesive
PRIMA-SOLDER
EG8050
<4x10-4
(150℃/60min)
N/A -20 35 Epoxy paste
adhesive
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Die Attach & TIM's for CPU

for CPU

Model Electrical
Resistivity
[ohm-cm]
Dielectric
Strength
[Volts/mil]
Glass
Transition
Temp.[℃]
Current
Carrying
Capabilities
[Amp/mm²]
Feature
PRIMA-BOND
ME8512
<4x10-4
(150℃/60min)
N/A 52 50 Epoxy paste
adhesive
ME8456-DA <4x10-4
(150℃/60min)
N/A -20 35 Flexible
die-attach
MC8880 <5x10-2
(200℃/1)
N/A 240 - Die-attach
ME7519-LB >1014 - 52 - Die-attach
adhesive
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放熱接着剤 Thermal Adhesives

Thermal Greases

cgr7018

Model Electrical
Resistivity
[ohm-cm]
Tensile
Elongation
[%]
Current
Carrying
Capabilities
[Amp/mm²]
Cured
Destiny
[gm/cc]
Feature
COOL-GREASE
CGR7018
>1x1013 Non-
curing
N/A 2.3 Silicon
thermal grease
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